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Opis

Heat transfer describe the exchange of thermal energy, between physical systems depending on pressure & temperature, by dissipating heat. Heat transfer across a contact intermediate formed by any two solid systems is usually accompanied by a measurable temperature drop because there exists a thermal resistance to heat flow in the region of the intermediate. Thermal contact resistance (TCR) or resistance is of interest in many engineering fields i.e. satellite, internal combustion engineering, space craft, microelectronics, bearing with lubrication, mechanical applications, heat transfer across granular solids, superconductors, aerospace structures etc. The Practical study of heat transfer through surface contact resistance is very essential for advancement of thermal applications. It is required to understand the heat transfer between composite pair having same as well as different interface material. The outcomes will very essential for design of different heat transfer thermal applications. The sole objective of the dissertation work is to reduce the Thermal Contact Resistance (TCR) and increases thermal efficiency of the application.

Szczegóły książki

• Pełny tytuł: Thermal contact resistance across different metallic composite pair
• Autor: Bipin Vyas, Nirmal Parmar, Deepak Jani
• Język: Angielski
• Oprawa: Miękka
• Liczba stron: 76
• EAN: 9783659742057
• ISBN: 3659742058
• ID: 15839405
• Wydawca: LAP Lambert Academic Publishing
• Waga: 130 g
• Wymiary: 220 × 150 × 5 mm
• Data wydania: 04. February 2017

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