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Więcej informacji o Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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Opis

The handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. Each chapter contains a summary of the state-of-the-art in a particular field and practical recommendations on how to apply current knowledge and technology to design, manufacture and operate a viable, reliable and cost-effective electronic component or photonic device, and on how to make such a device into a successful commercial product.The handbook can be used as a reference and as a manual for self-education. Designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists - this will be an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems, challenges, and solutions.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Pełny tytuł: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
• Podtytuł: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
• Autor: Ephraim Suhir, Y. C. Lee, C. P. Wong
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 1460
• EAN: 9780387279749
• ISBN: 0387279741
• ID: 01381438
• Wydawca: Springer-Verlag New York Inc.
• Waga: 3229 g
• Wymiary: 254 × 178 × 93 mm
• Data wydania: 09. May 2007

Ulubione w innej kategorii

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