Kod: 06506804
Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molde ... więcej
Za ten zakup dostaniesz 550 punkty
Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Kategoria Książki po angielsku Technology, engineering, agriculture Other technologies & applied sciences Applied optics
219.33 €
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