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Opis

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Pełny tytuł: Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
• Autor: Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 185
• EAN: 9781402073304
• ISBN: 1402073305
• ID: 01417913
• Wydawca: Springer, Berlin
• Waga: 470 g
• Wymiary: 234 × 156 × 12 mm
• Rok wydania: 2003

Ulubione w innej kategorii

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