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Więcej informacji o Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

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Opis

The reliability of components is a prime concern to electronics manufacturers and the failure of microelectronic packaging is a major source of component faults. Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research. This practical guide discusses theoretical aspects, experimental results, modeling techniques and results. The authors have used their extensive experience to produce detailed chapters covering temperature, moisture and mechanical shock induced failure in addition to adhesive interconnects and viscoelasticity. Useful program files and macros are included.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Pełny tytuł: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
• Autor: E.H. Wong, S.K. Woon, Y. W. Mai
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 482
• EAN: 9781845695286
• ISBN: 1845695283
• ID: 05098486
• Wydawca: Elsevier Science & Technology
• Waga: 830 g
• Wymiary: 229 × 152 × 30 mm
• Data wydania: 22. May 2015

Ulubione w innej kategorii

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