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Opis

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Pełny tytuł: Carbon Nanotubes for Interconnects
• Podtytuł: Process, Design and Applications
• Autor: Aida Todri-Sanial, Jean Dijon, Antonio Maffucci
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 333
• EAN: 9783319297446
• ISBN: 3319297449
• ID: 02910177
• Wydawca: Springer International Publishing AG
• Waga: 6447 g
• Wymiary: 235 × 155 × 24 mm
• Data wydania: 09. July 2016

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