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Więcej informacji o BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs

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Opis

BSIM-BULK compact model is the most recent industry standard model of the MOS transistor. It is used by the semiconductor industry as well as academicians and researchers for designing analog, RF, and logic circuits. While the model is commercially integrated into all major integrated circuit simulators, literature on model derivation, physical and numerical approximations are limited. In BSIM-BULK, the developers provide in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures addressing geometrical scaling, temperatures, etc. There is a dedicated chapter on extensive quality testing procedures and experimental results. Those working in the semiconductor industry often run into variety of problems like model non-convergence or non-physical simulation results. This is largely due to limited understanding of the internal operations of the model as the literature in the form of technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed. BSIM-BULK discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia. Reviews the latest advances in fabrication methods for metal chalcogenide-based biosensors Discusses the parameters of biosensor devices to aid in materials selection Provides readers with a look at the chemical and physical properties of reactive metals, noble metals, and transition metals chalcogenides and their connection to biosensor device performance

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Pełny tytuł: BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs
• Autor: Chenming Hu, Harshit Agarwal, Chetan Gupta, Yogesh Chauhan
• Język: Angielski
• Oprawa: Miękka
• Liczba stron: 325
• EAN: 9780323856775
• ID: 39347735
• Wydawca: WOODHEAD PUB
• Wymiary: 229 × 152 mm
• Data wydania: 01. June 2023

Ulubione w innej kategorii

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