Zobacz książki o podobnej tematyce

Powiadomienie o dostępności

Więcej informacji o Advanced Metallization Conference 2002 (AMC 2002): Volume 18

• Dane szczegółowe
• Opis
• Ulubione w innej kategorii

Za ten zakup dostaniesz 92 punkty

Opis

Leading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials. Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects. For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration. Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies. Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Pełny tytuł: Advanced Metallization Conference 2002 (AMC 2002): Volume 18
• Autor: B. M. MelnickT. S. CaleS. ZaimaT. Ohta
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 882
• EAN: 9781558997196
• ISBN: 1558997199
• ID: 02060362
• Wydawca: Materials Research Society
• Waga: 1350 g
• Wymiary: 235 × 160 × 50 mm
• Data wydania: 01. January 2003

Ulubione w innej kategorii

---

---

---