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Viac informácií o knihe Design And Modeling For 3d Ics And Interposers

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Nákupom získate 384 bodov

Anotácia knihy

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Design And Modeling For 3d Ics And Interposers
• Autor: Madhavan Swaminathan
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 380
• EAN: 9789814508599
• ISBN: 9814508594
• ID: 01995954
• Nakladateľ: WOSQ
• Hmotnosť: 673 g
• Rozmery: 159 × 235 × 27 mm
• Dátum vydania: 24. December 2013

Obľúbené z iného súdka

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