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Book synopsis

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Wafer Level 3-D ICs Process Technology
• Author: Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
• Language: English
• Binding: Paperback
• Number of pages: 410
• EAN: 9781441945624
• ISBN: 1441945628
• ID: 01423024
• Publisher: Springer-Verlag New York Inc.
• Weight: 632 g
• Dimensions: 235 × 155 × 20 mm
• Date of publishing: 28. October 2010

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