Code: 03618518
Wafer Bonding
by Marin Alexe, Ulrich Gösele
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of ... more
- Language:
English - Binding: Hardback
- Number of pages: 504
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, 2004
- More about this
413.27 €
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Book synopsis
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Book details
Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
413.27 €
- Full title: Wafer Bonding
- Subtitle: Applications and Technology
- Author: Marin Alexe, Ulrich Gösele
- Language: English
- Binding: Hardback
- Number of pages: 504
- EAN: 9783540210498
- ISBN: 3540210490
- ID: 03618518
- Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
- Weight: 1035 g
- Dimensions: 235 × 155 × 33 mm
- Date of publishing: 14. May 2004
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