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Book synopsis

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Book details

• Full title: RF and Microwave Microelectronics Packaging II
• Author: KEN KUANG
• Language: English
• Binding: Paperback
• Number of pages: 172
• EAN: 9783319847191
• ISBN: 9783319847191
• ID: 19737758
• Publisher: Springer International Publishing AG
• Weight: 2934 g
• Dimensions: 235 × 155 × 11 mm
• Date of publishing: 09. June 2018

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