You might also like

More about Pick-up Process Analysis of a Die Bonder

• Book details
• Synopsis
• Trending among others

You get 165 loyalty points

Book synopsis

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Book details

Book category Books in English Technology, engineering, agriculture Mechanical engineering & materials Mechanical engineering

• Full title: Pick-up Process Analysis of a Die Bonder
• Author: Yeong-Jyh Lin, Sheng-Jye Hwang
• Language: English
• Binding: Paperback
• Number of pages: 136
• EAN: 9783639000344
• ISBN: 363900034X
• ID: 06810235
• Publisher: VDM Verlag Dr. Mueller E.K.
• Weight: 191 g
• Dimensions: 229 × 152 × 7 mm
• Date of publishing: 22. April 2008

Trending among others

---

---

---