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Book synopsis

We are today in the era of gigascale 2D and 3D §integrated circuits. These microchips are typically §considered to be "interconnect limited", with §performance limited by signal, power, clock and §thermal interconnect networks. Techniques to tackle §this interconnect challenge are proposed and §quantitatively evaluated in this book. Topics §described by the author include integrated §microchannel cooling of 3D stacked dice, repeater §insertion models, carbon nanotube interconnects, §parallel processing architectures, electromigration §avoidance methods and a CAD tool to co-design §signal, power, clock and thermal interconnect §networks of microchips. This book should be §especially useful to students and professionals in §the areas of microelectronics, VLSI design, §packaging and computer architecture.

Book details

Book category Books in English Technology, engineering, agriculture Technology: general issues

• Full title: Optimal Interconnect Networks for 2D and 3D Microchips
• Author: Deepak Sekar
• Language: English
• Binding: Paperback
• Number of pages: 144
• EAN: 9783639073959
• ISBN: 3639073959
• ID: 06816661
• Publisher: VDM Verlag
• Weight: 222 g
• Dimensions: 229 × 152 × 9 mm
• Date of publishing: 01. March 2009

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