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Book synopsis

This book presents selected papers from the 3rd International Conference on Micro-Electronics and Telecommunication Engineering, held at SRM Institute of Science and Technology, Ghaziabad, India, on 30-31 August 2019. It covers a wide variety of topics in micro-electronics and telecommunication engineering, including micro-electronic engineering, computational remote sensing, computer science and intelligent systems, signal and image processing, and information and communication technology. 

Book details

Book category Books in German Naturwissenschaften, Medizin, Informatik, Technik Technik Bau- und Umwelttechnik

• Full title: Micro-Electronics and Telecommunication Engineering
• Author: Valentina Emilia Balas, Le Hoang Son
• Language: English
• Binding: Paperback
• Number of pages: 735
• EAN: 9789811523311
• ISBN: 9811523312
• ID: 35474597
• Publisher: Springer Verlag, Singapore
• Weight: 1139 g
• Dimensions: 235 × 155 × 41 mm
• Date of publishing: 03. April 2021

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