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Book synopsis

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Book details

Book category Books in English Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Full title: Materials for Advanced Packaging
• Author: Daniel Lu, C. P. Wong
• Language: English
• Binding: Hardback
• Number of pages: 724
• EAN: 9780387782188
• ISBN: 0387782184
• ID: 01383077
• Publisher: Springer-Verlag New York Inc.
• Weight: 1224 g
• Dimensions: 239 × 162 × 44 mm
• Date of publishing: 01. December 2008

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