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Book synopsis

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Book details

Book category Books in English Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Full title: Low Dielectric Constant Materials for IC Applications
• Author: Paul S. Ho, Wei William Lee, Jihperng Leu
• Language: English
• Binding: Paperback
• Number of pages: 310
• EAN: 9783642632211
• ISBN: 3642632211
• ID: 07002286
• Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
• Weight: 510 g
• Dimensions: 235 × 155 × 19 mm
• Date of publishing: 04. October 2012

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