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Title synopsis

The conference is focused on recent advances and emerging technologies in semiconductor processing before, during and after ion implantation. The content encompasses fundamental physical understanding, common and novel applications as well as equipment issues, maintenance and design. The primary audience is process engineers in the microelectronics industry. Additional contributions come from academia and other industry segments (automotive, aerospace, and medical device manufacturing).

Title details

Title category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Ion Implantation Technology
• Author: Edmund G. Seebauer, Susan B. Felch, Amitabh Jain
• Language: English
• Binding: CD
• Number of pages: 576
• EAN: 9780735406346
• ISBN: 9780735406346
• ID: 06619666
• Publisher: American Institute of Physics
• Weight: 68 g
• Dimensions: 279 × 216 × 10 mm
• Date of publishing: 01. April 2009

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