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Book synopsis

This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning,  ANN and deep neural networks,  RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Innovations in Signal Processing and Embedded Systems
• Subtitle: Proceedings of ICISPES 2021
• Author: Jyotsna Kumar Mandal, Mike Hinchey, K. Sreenivas Rao
• Language: English
• Binding: Hardback
• Number of pages: 498
• EAN: 9789811916687
• ID: 38813558
• Publisher: Springer, Berlin
• Weight: 1021 g
• Dimensions: 235 × 155 × 32 mm
• Published: 2022

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