Area Array Package Design / Najlacnejšie knihy
Area Array Package Design

Code: 07181188

Area Array Package Design

by Ken Gilleo

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital inform ... more

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Book synopsis

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.

Book details

Book category Books in English Technology, engineering, agriculture Technology: general issues Engineering: general

167.34

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