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Book synopsis

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Book details

Book category Books in English Computing & information technology Computer science Computer architecture & logic design

• Full title: Arbitrary Modeling of TSVs for 3D Integrated Circuits, 1
• Author: Khaled Mohamed, Yehea Ismail, Alaa El-Rouby
• Language: English
• Binding: Hardback
• Number of pages: 230
• EAN: 9783319076102
• ISBN: 3319076108
• ID: 02667896
• Publisher: Springer, Berlin
• Weight: 455 g
• Dimensions: 235 × 155 × 15 mm
• Date of publishing: 22. August 2014

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