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Book synopsis

Leading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials. Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects. For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration. Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies. Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.

Book details

Book category Books in English Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Full title: Advanced Metallization Conference 2002 (AMC 2002): Volume 18
• Author: B. M. MelnickT. S. CaleS. ZaimaT. Ohta
• Language: English
• Binding: Hardback
• Number of pages: 882
• EAN: 9781558997196
• ISBN: 1558997199
• ID: 02060362
• Publisher: Materials Research Society
• Weight: 1350 g
• Dimensions: 235 × 160 × 50 mm
• Date of publishing: 01. January 2003

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