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Opis

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Szczegóły książki

Kategoria Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Pełny tytuł: RF and Microwave Microelectronics Packaging II
• Autor: Ken Kuang, Rick Sturdivant
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 172
• EAN: 9783319516967
• ISBN: 3319516965
• ID: 15496751
• Wydawca: Springer International Publishing AG
• Waga: 4085 g
• Wymiary: 235 × 155 × 16 mm
• Data wydania: 22. March 2017

Ulubione w innej kategorii

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