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Opis

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation Pds. /LIST Pds. Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Szczegóły książki

Kategoria Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Pełny tytuł: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
• Autor: G.Q. Zhang, L.J. Ernst, O. de Saint Leger
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 192
• EAN: 9780792372783
• ISBN: 0792372786
• ID: 01396959
• Wydawca: Springer, Berlin
• Waga: 472 g
• Wymiary: 240 × 160 × 12 mm
• Rok wydania: 2000

Ulubione w innej kategorii

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